At the heart of Mirabilis Design’s innovative solutions is VisualSim, a powerful tool for system-level modeling and simulation. VisualSim plays a critical role in optimizing semiconductor designs, enabling rapid trade-offs and performance analysis.

1. Chiplets and 3D-IC: VisualSim helps model advanced chiplet and 3D-IC architectures. It enables designers to simulate interconnect delays, task partitioning, minimizing power consumption, and measuring the thermal characteristics. This ensures lowest-cost and reliable designs that meet the demanding requirements of modern applications.
2. Thermal Analysis of SoC Architectures: Thermal management expands the scope of SoCs and keeps the system costs within limits. VisualSim provides comprehensive thermal analysis capabilities, allowing designers to simulate and analyze thermal behavior early in the design process. This helps identify power spikes, battery life cycle, cooling strategy and package planning, enabling thermal engineers to be involved early in the design process.
3. Performance Comparison of DNN: VisualSim enables accurate simulation of DNN workloads on different hardware platforms, including CPUs, GPUs, and TPUs. Designers can compare performance metrics and choose the optimal configuration for their AI applications, enhancing overall system efficiency.
4. Chiplet System Modeling: Modeling chiplet systems can be complex due to the need for effective inter-chip communication and power management models. VisualSim provides libraries for the modeling of these architectures, allowing designers to perform architecture trade-offs and system-level analysis. This leads to optimized designs that meet performance and power requirements.