Digital System Hardware Power Monitor

Feb 03, 2021  |  Author : admin_mirabilis

A hardware monitor is a common component of modern motherboards, which can either come as a separate chip, often interfaced through I²C or SMBus, or as part of a Super I/O solution, often interfaced through Low Pin Count (LPC).These devices make it possible to monitor temperature in the chassis, voltage supplied to the motherboard by the power supply unit and the speed of the computer fans that are connected directly to one of the fan headers […]

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Digital System Strategies to Reduce Power

Feb 02, 2021  |  Author : admin_mirabilis

Power Up Your Tech: Strategies to Reduce Power Consumption in Digital Systems In today’s world, our devices are constantly demanding power. From laptops and smartphones to gaming consoles and servers, keeping these digital systems running smoothly can eat into our energy bills. But fear not, there are clever strategies that developers and engineers can use […]

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Digital System Power Table Configuration

Feb 01, 2021  |  Author : admin_mirabilis

A Power_Manager can be updated via the Power Table directly, or through the use of RegEx expressions that will manually alter the same Power Table entries.  A Power_Manager Table references the devices included in the power domain, including specific state names, speed (Mhz), t_OnOff (time), and operating voltages. The power domain may be a single centralized or decentralized power […]

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Digital System Device Junction Temperature vs. Power

Jan 27, 2021  |  Author : admin_mirabilis

Chip expressions used to determine Chip Device from a Texas Instrument white paper on junction temperatures, ultimately determining junction temperature >> device based on power. The actual chip junction temperature may differ depending on parameters entered below, especially Theta_CS => case to heatsink or vapor chamber; previously discussed.  Steps outlined:             • Measure the case temperature using the […]

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Digital System Vapor Chamber vs. Heat Sink

Jan 25, 2021  |  Author : admin_mirabilis

Digital Systems must maintain a Thermal Design Power (TDP) requirement per chip, else chip reliability may be drastically reduced, ultimately resulting in a failure? Currently, the TDP requirement can be maintained, if heat energy can be removed faster than power, energy is added. Vapor Chamber: (1) Vapor Chamber is a heat accumulator, exchanger that limits the maximum temperature based […]

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