Chip expressions used to determine Chip Device from a Texas Instrument white paper on junction temperatures, ultimately determining junction temperature >> device based on power. The actual chip junction temperature may differ depending on parameters entered below, especially Theta_CS => case to heatsink or vapor chamber; previously discussed.  Steps outlined:             • Measure the case temperature using the […]

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Digital Systems must maintain a Thermal Design Power (TDP) requirement per chip, else chip reliability may be drastically reduced, ultimately resulting in a failure? Currently, the TDP requirement can be maintained, if heat energy can be removed faster than power, energy is added. Vapor Chamber: (1) Vapor Chamber is a heat accumulator, exchanger that limits the maximum temperature based […]

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Power management can be either centralized, distributed, or a combination of both.  The type of devices supported by a power manager chip, or integrated into a system-on-chip presents different power management alternatives.  If the devices, such as memory chips, are homogenous; then a centralized power manager function becomes more attractive for a number of reasons: (1) Same […]

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Prior blog on peak and average power highlights benefits of reordering device activity to increase Digital System reliability.  This blog carries this concept one step further by accumulating task or thread requests to avoid leaving memory in Active state (full power) spread out over time. The type of task or thread determines if this is feasible. […]

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